Chip cooling breakthrough will reduce data center power costs

Chip cooling breakthrough will reduce data center power costs

Traditional passive heatsinks affixed to microprocessors for cooling don’t work well enough for today’s high-speed computations and data throughputs and should be junked, says a group of mechanical engineering researchers.

A better option, they say, are “spirals or mazes that coolant can travel through” within tiny channels on the actual processor. That technique could massively improve efficiency, says Scott Schiffres, an assistant professor at Binghamton University in New York, in an article on the school’s website. The school has developed this new method for cooling chips.

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